**Executive Summary: Expansion of Semiconductor Manufacturing in India**
On August 12, 2025, the Union Cabinet, chaired by the Prime Minister, approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), signaling continued momentum in the development of India's semiconductor ecosystem. These projects, with a cumulative investment of approximately Rs. 4,600 crore, are expected to generate 2,034 skilled jobs, and further stimulate the electronic manufacturing sector. This brings the total number of approved projects under the ISM to ten, representing a cumulative investment of around Rs. 1.60 lakh crore across six states.
The approved projects include:
* **SiCSem Private Limited (Odisha):** In collaboration with ClasSiC Wafer Fab Ltd., UK, this project will establish an integrated Silicon Carbide (SiC) based compound semiconductor facility in Bhubaneshwar. It will have an annual capacity of 60,000 wafers and a packaging capacity of 96 million units, serving applications in missiles, defense equipment, electric vehicles, railways, fast chargers, data centers, consumer appliances, and solar power inverters.
* **3D Glass Solutions Inc. (Odisha):** This unit in Bhubaneshwar will establish a vertically integrated advanced packaging and embedded glass substrate unit, featuring glass interposers, silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. The planned capacity is approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum, targeting applications in defense, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics.
* **Advanced System in Package (ASIP) Technologies (Andhra Pradesh):** In technical collaboration with APACT Co. Ltd, South Korea, this unit will have an annual capacity of 96 million units, producing semiconductors for mobile phones, set-top boxes, automotive applications, and other electronic products.
* **Continental Device India Private Limited (CDIL) (Punjab):** This project involves the expansion of CDIL's existing discrete semiconductor manufacturing facility in Mohali. The expansion will add a capacity of 158.38 million units annually, producing high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors in both Silicon and Silicon Carbide, with applications in automotive electronics (including EVs and charging infrastructure), renewable energy systems, power conversion, industrial applications, and communication infrastructure.
These projects include India’s first commercial compound fab and a highly advanced glass-based substrate semiconductor packaging unit. The Government's support for chip design capabilities through design infrastructure provided to 278 academic institutions and 72 startups, along with the talent development program benefiting over 60,000 students, complements these manufacturing initiatives. These projects are expected to significantly contribute to the Atmanirbhar Bharat (self-reliant India) initiative, addressing the growing demand for semiconductors across various sectors.
Key Entities Referenced
India Semiconductor Mission: A government initiative to promote semiconductor manufacturing in India.
ODISHA: A state in India, location for semiconductor manufacturing units.
PUNJAB: A state in India, location for semiconductor manufacturing units.
ANDHRA PRADESH: A state in India, location for semiconductor manufacturing units.
SiCSem Private Limited: A company setting up a Silicon Carbide based Compound Semiconductors manufacturing facility in Odisha.
Continental Device India Private Limited: A company expanding its discrete semiconductor manufacturing facility in Punjab.
3D Glass Solutions Inc.: A company setting up an advanced packaging and embedded glass substrate unit in Odisha.
Advanced System in Package Technologies: A company setting up a semiconductor manufacturing unit in Andhra Pradesh.
Cabinet
Cabinet approves semiconductor manufacturing
units in ODISHA, PUNJAB and ANDHRA PRADESH
with an outlay of Rs.4600 crore
India Semiconductor Mission: Momentum builds
further as India advances into Compound
Semiconductor and Advanced Packaging landscape
Posted On: 12 AUG 2025 3:16PM by PIB Delhi
The Union Cabinet chaired by Prime Minister Shri Narendra Modi approved four more semiconductor
projects under India Semiconductor Mission (ISM).
Momentum is building up in semiconductor ecosystem in India with the six approved projects
already in various stages of execution. These four proposals approved today are from SiCSem,
Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in
Package (ASIP) Technologies.
These four approved proposals will setup semiconductor manufacturing facilities with cumulative
investment of around Rs.4,600 crore and are expected to generate a cumulative employment for
2034 skilled professionals which would catalyse the electronic manufacturing ecosystem resulting in
creation of many indirect jobs. With these four more approvals today, total approved projects under
ISM reaches to 10 with cumulative investments of around Rs.1.60 lakh crore in 6 states.
Given the growing demand of semiconductors in telecom, automotive, datacentres, consumer
electronics and industrial electronics, these four new approved semiconductors projects would
significantly contribute to making Atmanirbhar Bharat.
SiCSem and 3D Glass will be set up in Odisha. CDIL is located in Punjab and ASIP will be set up in Andhra
Pradesh.
SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish integrated
facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar,
Odisha. This will be 1st commercial compound fab in the country. The project proposes to
manufacture Silicon Carbide devices. This compound semiconductor fab will have an annual
capacity of 60,000 wafers and packaging capacity of 96 million units. The proposed products will
have applications in Missiles, Defence equipment, Electric Vehicles (EVs), Railway, Fast Chargers,
Data Centre racks, Consumer Appliances, and Solar Power Inverters.
3D Glass Solutions Inc. (3DGS) will be setting up a vertically integrated advanced packaging and
embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring world’s
most advanced packaging technology to India. Advanced packaging brings the next generation of
efficiency to semiconductor industry. The facility will have a large variety of advanced technologies
including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration
(3DHI) modules. Planned capacity of this unit will be approximately 69,600 glass panel substrates,
50 million assembled units, and 13,200 3DHI modules per annum. The proposed products will have
significant applications in defence, high-performance computing, artificial intelligence, RF andautomotive, photonics and co-packaged optics etc.
Advanced System in Package Technologies (ASIP) will setup a semiconductor manufacturing unit
in Andhra Pradesh, under technology tie-up with APACT Co. Ltd, South Korea, with an annual
capacity of 96 Million units. The manufactured products will find applications in mobile phones, set-
top boxes, automobile applications, and other electronic products.
Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali,
Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as
MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide.
The annual capacity of this brownfield expansion will be to the tune of 158.38 million units. The
devices manufactured by these proposed units will have applications in Automotive electronics
including EVs and its charging infrastructure, Renewable energy systems, Power conversion
applications, industrial applications and communication infrastructure.
With the approval of these projects, semiconductor ecosystem in country would get significant boost
as these projects include country’s first commercial compound fab as well as highly advanced
glass-based substrate semiconductor packaging unit.
These would complement the growing world class chip design capabilities coming up in the country
which are propelled by design infrastructure support provided by Government to 278 academic
institutions and 72 start-ups.
Already more than 60,000 students have availed the benefits of talent development programme.
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MJPS/BM
(Release ID: 2155456)