**Executive Summary: Semiconductor Manufacturing Unit Approvals under the India Semiconductor Mission**
On August 12, 2025, the Union Cabinet, chaired by the Prime Minister, approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), with a cumulative investment of approximately Rs. 4,600 crore. These projects are expected to generate 2,034 skilled jobs and further catalyze the electronic manufacturing ecosystem in India.
The approved projects are:
1. **SiCSem Private Limited (Odisha):** In collaboration with ClasSiC Wafer Fab Ltd., UK, SiCSem will establish an integrated Silicon Carbide (SiC) based compound semiconductor fabrication facility in Info Valley, Bhubaneshwar, Odisha. This will be India's first commercial compound fab, with an annual capacity of 60,000 wafers and a packaging capacity of 96 million units. Products will target applications in missiles, defense equipment, electric vehicles, railways, fast chargers, data center racks, consumer appliances, and solar power inverters.
2. **3D Glass Solutions Inc. (Odisha):** 3DGS will establish a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will focus on advanced packaging technologies, including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. The planned capacity is approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum. Applications include defense, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics.
3. **Advanced System in Package (ASIP) Technologies (Andhra Pradesh):** ASIP will set up a semiconductor manufacturing unit in Andhra Pradesh, in collaboration with APACT Co. Ltd, South Korea, with an annual capacity of 96 million units. The manufactured products will be used in mobile phones, set-top boxes, automobile applications, and other electronic products.
4. **Continental Device India Private Limited (CDIL) (Punjab):** CDIL will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The expansion will manufacture high-power discrete semiconductor devices, including MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, in both Silicon and Silicon Carbide. The annual capacity of this brownfield expansion will be approximately 158.38 million units. These devices will be used in automotive electronics (including EVs and charging infrastructure), renewable energy systems, power conversion applications, industrial applications, and communication infrastructure.
With these approvals, the total number of projects approved under the ISM reaches ten, with cumulative investments of approximately Rs. 1.60 lakh crore across six states. These projects will support the growing demand for semiconductors in various sectors and contribute to the Atmanirbhar Bharat initiative. This also complements the existing chip design capabilities supported by design infrastructure in 278 academic institutions and 72 startups, with over 60,000 students benefiting from the talent development program.
Key Entities Referenced
India Semiconductor Mission: A government initiative to promote semiconductor manufacturing in India.
ODISHA: State in India where SiCSem and 3D Glass Solutions Inc. will set up manufacturing units.
PUNJAB: State in India where Continental Device India Private Limited (CDIL) is located and will expand its facility.
ANDHRA PRADESH: State in India where Advanced System in Package (ASIP) Technologies will set up a semiconductor manufacturing unit.
SiCSem Private Limited: Company setting up a Silicon Carbide (SiC) based Compound Semiconductors integrated facility in Odisha.
Continental Device India Private Limited CDIL: Company expanding its discrete semiconductor manufacturing facility in Punjab.
3D Glass Solutions Inc.: Company setting up an advanced packaging and embedded glass substrate unit in Odisha.
Advanced System in Package ASIP Technologies: Company setting up a semiconductor manufacturing unit in Andhra Pradesh.
Ministry of Electronics & IT
Cabinet approves semiconductor manufacturing
units in ODISHA, PUNJAB and ANDHRA PRADESH
with an outlay of Rs.4600 crore
India Semiconductor Mission: Momentum builds
further as India advances into Compound
Semiconductor and Advanced Packaging landscape
Posted On: 12 AUG 2025 3:18PM by PIB Delhi
The Union Cabinet chaired by Prime Minister Shri Narendra Modi approved four more semiconductor
projects under India Semiconductor Mission (ISM).
Momentum is building up in semiconductor ecosystem in India with the six approved projects already in
various stages of execution. These four proposals approved today are from SiCSem, Continental Device India
Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.
These four approved proposals will setup semiconductor manufacturing facilities with cumulative investment
of around Rs.4,600 crore and are expected to generate a cumulative employment for 2034 skilled
professionals which would catalyse the electronic manufacturing ecosystem resulting in creation of many
indirect jobs. With these four more approvals today, total approved projects under ISM reaches to 10 with
cumulative investments of around Rs.1.60 lakh crore in 6 states.
Given the growing demand of semiconductors in telecom, automotive, datacentres, consumer electronics and
industrial electronics, these four new approved semiconductors projects would significantly contribute to
making Atmanirbhar Bharat.
SiCSem and 3D Glass will be set up in Odisha. CDIL is located in Punjab and ASIP will be set up in Andhra
Pradesh.
SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish integrated facility of
Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar, Odisha. This will be
1st commercial compound fab in the country. The project proposes to manufacture Silicon Carbide devices.
This compound semiconductor fab will have an annual capacity of 60,000 wafers and packaging capacity of
96 million units. The proposed products will have applications in Missiles, Defence equipment, Electric
Vehicles (EVs), Railway, Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters.
3D Glass Solutions Inc. (3DGS) will be setting up a vertically integrated advanced packaging and embedded
glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring world’s most advanced
packaging technology to India. Advanced packaging brings the next generation of efficiency to semiconductor
industry. The facility will have a large variety of advanced technologies including glass interposers with
passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. Planned capacity of this unit
will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules
per annum. The proposed products will have significant applications in defence, high-performance computing,
artificial intelligence, RF and automotive, photonics and co-packaged optics etc.
Advanced System in Package Technologies (ASIP) will setup a semiconductor manufacturing unit in Andhra
Pradesh, under technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 Millionunits. The manufactured products will find applications in mobile phones, set-top boxes, automobile
applications, and other electronic products.
Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab.
The proposed facility will manufacture high-power discrete semiconductor devices such as MOSFETs,
IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide. The annual capacity of
this brownfield expansion will be to the tune of 158.38 million units. The devices manufactured by these
proposed units will have applications in Automotive electronics including EVs and its charging infrastructure,
Renewable energy systems, Power conversion applications, industrial applications and communication
infrastructure.
With the approval of these projects, semiconductor ecosystem in country would get significant boost as these
projects include country’s first commercial compound fab as well as highly advanced glass-based substrate
semiconductor packaging unit.
These would complement the growing world class chip design capabilities coming up in the country which
are propelled by design infrastructure support provided by Government to 278 academic institutions and 72
start-ups.
Already more than 60,000 students have availed the benefits of talent development programme.
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MJPS/BM
(Release ID: 2155459)