MoU signed to bring substrate manufacturing technology to India; Govt. of Odisha, Intel and 3DGS parties to the agreement

**Executive Summary** On May 29, 2026, the Government of Odisha, Intel Corporation, and 3DGS Inc. USA signed a landmark Memorandum of Understanding (MoU) to establish an Advanced Packaging Glass Core Substrate Manufacturing Facility in Odisha. This phased project, spanning five to six years, is part of the India Semiconductor Mission and aims to localize high-technology manufacturing in the Bhubaneswar–Khurda region. The initiative is expected to generate significant high-skilled employment and position India as a global hub for semiconductor technology. **Key Points / Main Content** **Project Overview and Location** * The agreement establishes a framework for an Advanced Packaging Glass Core Substrate Manufacturing Facility. * The facility is proposed to be situated in the Bhubaneswar–Khurda region of Odisha. * The project is identified as one of the largest high-technology manufacturing investments in India to date. **Technical Specifications and Partnerships** * The facility will focus on advanced packaging glass core substrates, high-density interconnect substrates, and associated semiconductor technologies. * Intel Corporation will provide essential technology know-how and process expertise for the project. * The initiative aligns with the India Semiconductor Mission to strengthen domestic manufacturing, design ecosystems, and supply chain capabilities. **Economic and Employment Impact** * The project will be implemented in phases over a period of five to six years. * It is expected to create direct high-skilled employment opportunities and substantial indirect employment across the technology ecosystem. * The facility will promote export-oriented manufacturing and contribute to national capability development. **Impact Analysis** **Government of Odisha** **Impact** The state is set to become an emerging global center for semiconductor manufacturing and digital infrastructure, attracting further high-tech investments. **Action Required** Coordinate with Intel and 3DGS to provide the necessary regional support and infrastructure in the Bhubaneswar–Khurda region for the project’s phased implementation. **Intel Corporation and 3DGS Inc. USA** **Impact** These entities will lead the transfer of substrate manufacturing technology to India, expanding their manufacturing footprint in the region. **Action Required** Intel must provide the technical know-how and process expertise required to establish and operate the advanced packaging facility. **Indian Semiconductor Workforce** **Impact** The workforce will benefit from the creation of direct high-skilled jobs and indirect employment opportunities within the broader manufacturing sector. **Action Required** Prospective employees and educational institutions must focus on high-technology skill development to meet the requirements of the new facility over the next five to six years.

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