Parliament Question: Progress of Semiconductor Mission

# O.I.H. GOVERNMENT OF INDIA MINISTRY OF ELECTRONICS AND INFORMATION TECHNOLOGY RAJYA SABHA UNSTARRED QUESTION NO. 1674 TO BE ANSWERED ON: 13.02.2026 PROGRESS OF SEMICONDUCTOR MISSION 1674. # SHRI NEERAJ DANGI: Will the Minister of ELECTRONICS AND INFORMATION TECHNOLOGY be pleased to state: (a) the total amount of domestic and foreign investment received so far in the semiconductor manufacturing sector; (b) whether Government has any data containing project-wise details of progress of Semiconductor Mission, if so, the details thereof; (c) whether any new policy initiative is proposed to enable additional partnerships with global companies in this sector; and (d) to what extent the incentive packages provided by Government for semiconductor manufacturing are competitive in comparison with those of other countries such as the United States, Taiwan and Korea? ANSWER MINISTER OF STATE FOR ELECTRONICS AND INFORMATION TECHNOLOGY (SHRI JITIN PRASADA) (a) to (d): The semiconductor development strategy is inspired by Hon’ble Prime Minister’s vision of Atmanirbhar Bharat and Make in India, Make for the world. As part of this strategy, India aims to develop a complete ecosystem, ranging from design, fabrication, assembly, testing, packaging and module manufacturing. India’s Semiconductor strategy builds on the success of the electronics manufacturing. India is providing the most competitive incentives though following programmes to promote electronics/semiconductor manufacturing across the country, thereby increasing India’s share in global electronics markets: a) Semicon India Programme b) PLI Scheme for IT Hardware and Large-Scale Electronics manufacturing c) Electronics Component Manufacturing Scheme (ECMS) d) Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS) e) Electronics Manufacturing Clusters Scheme (EMC) f) Modified Special Incentive Package Scheme (M-SIPS) Given the foundational nature of semiconductor industry for the economy, the Government launched the ‘Semicon India Programme’ with a total outlay of Rs. 76,000 crore for thedevelopment of semiconductor and display manufacturing ecosystem in the country. Following are salient achievements under this Programme: ● Government has approved 10 projects with envisaged investments of about Rs. 1.6 Lakh Crore which includes 2 fabs and 8 packaging units. These units inter-alia include CMOS (Silicon) fab, Silicon Carbide fab, advanced packaging, memory packaging, etc. These projects are in various stages of implementation and pilot production has started in 4 units. Details of the 10 projects are provided in Annexure. ● 24 chip design projects have been supported through startups. 16 have completed tapeouts and 13 have received VC funding. ● 350 universities have been provided access to EDA tools, used by 65 thousand engineers Chip design is a strength of India, with Indian engineers already designing cutting-edge chips, for almost all the major global semiconductor companies. India already has a strong design talent base. More than 20% of the global semiconductor design engineers are of Indian origin, providing a robust foundation for scaling indigenous and globally competitive semiconductor design solutions. The development of advanced node manufacturing capability will position India as a reliable and responsible stakeholder in the global semiconductor ecosystem. This would help India build strategic relationships and promote collaboration. Recently, Qualcomm taped-out its 2nm chip designed in India. Through government policies and business forums, Government enables outreach and partnerships with global companies. Many approved companies under Semicon India Programme have entered into technology partnership with global semiconductor. Further, Union Budget for 2026-27 has also announced ISM 2.0 to further expand semiconductor manufacturing ecosystem. ******Annexure Details of approved semiconductor manufacturing projects: 1. Micron Technology Inc. is establishing semiconductor manufacturing facility in Gujarat with an investment of Rs.22,516 crore. Micron’s facility in India will enable assembly and test manufacturing for both DRAM and NAND products and address demand from domestic and international markets. The production capacity is around 14 million units per week. 2. Tata Electronics Private Limited (TEPL) is establishing semiconductor manufacturing facility in Gujarat with an investment of Rs. 91,526 crore. The fab facility will be set up in technology partnership with PSMC, Taiwan. The production capacity of the project would be around 50,000 wafer starts per month (WSPM). 3. Tata Electronics Private Limited (TEPL) is establishing semiconductor manufacturing facility in Assam with an investment of Rs.27,120 crores. The facility will use indigenous semiconductor packaging technologies with a production capacity of 48 million units per day. 4. CG Power and Industrial Solutions Limited is establishing semiconductor manufacturing facility in Gujarat with an investment of Rs. 7,584 crore. The facility will be set up as a joint venture partnership with Renesas Electronics America Inc., USA, and STARS Microelectronic, Thailand. The Technology would be provided for this facility by Renesas Electronics Corporation, Japan and STARS Microelectronic, Thailand. The production capacity would be around 15.07 million units per day. 5. Kaynes Technology India Limited (KTIL) is establishing semiconductor manufacturing facility in Gujarat with an investment of Rs. 3,307 crores for Wire bond Interconnect, Substrate Based Packages. The Technology would be provided by ISO Technology Sdn. Bhd. and AOI Electronics Co. Ltd. (AOI). The facility will have the capacity to produce more than 6.33 million chips per day. 6. HCL – Foxconn (VSIPL) is establishing semiconductor manufacturing facility in Uttar Pradesh with an investment of Rs 3,706 crores for display driver ICs (DDIC) using Gold (Au) Bump technology along with chip probing facilities and die processing services. The Technology would be provided by Hon Hai, Taiwan. The facility will be set up as a joint venture partnership between VSIPL and Foxconn, India. The production capacity would be around 20K wafers per month/36 million chips per month. 7. 3D Glass Solutions Inc. (3DGS) is establishing semiconductor manufacturing facility in Odisha with an investment of Rs. 1,943 crores. The plant will handle the assembly of packaged products such as Flip Chip Ball Grid Array (FCBGA) assembly, Radio Frequency System in Package (RF SiP), Antenna in Package System in Package (AiP SiP), glass interposers with passives and silicon bridges and 3D Heterogeneous Integration (3DHI) modules. The Proposed installed capacity for glass panel substrate production, assembly and 3DHI is around 5800 panels per month, 4.20 million units per month, and 1100 units per months respectively. 8. SiCSem Private Limited is establishing semiconductor manufacturing facility in Odisha with an investment of Rs. 2,066 crores. The facility will be set up in technology partnership with Clas- SiC Wafer Fab Ltd. for SiC fab and Continental Device India Pvt. Ltd. for packaging. The production capacity is 5,000 wafers/month, and the packaging capacity is 8 million units/month. 9. Continental Device India Private Limited (CDIL) is expanding its semiconductor manufacturing facility in Punjab, with an investment of Rs. 117 crores. The facility will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, SchottkyBypass Diodes, and transistors, both in Silicon and Silicon Carbide. The production capacity will be around 158.38 million units/annum. 10. Advanced System in Package Technologies Private Limited (ASIP) is establishing semiconductor manufacturing facility in Andhra Pradesh, with an investment of Rs. 480 crores. The facility will be set up in technology partnership with APACT Co. Ltd, South Korea. The production capacity of the facility would be around 96 million units/annum. *****