**Executive Summary**
This document announces Prime Minister Narendra Modi's participation in the groundbreaking ceremony of the HCL-Foxconn Joint Venture project (India Chip Pvt. Ltd.) on February 21, 2026, at the Yamuna Expressway Industrial Development Authority (YEIDA), Uttar Pradesh. The project aims to boost India's high-end manufacturing and semiconductor ecosystem and catalyze growth in ancillary sectors. The Prime Minister will address the gathering via video conferencing at approximately 5 PM.
**Key Points / Main Content**
* **Project Overview:**
* The HCL-Foxconn Joint Venture project is named India Chip Pvt. Ltd.
* It is an Outsourced Semiconductor Assembly and Test (OSAT) facility.
* The facility will be located in the Yamuna Expressway Industrial Development Authority (YEIDA), Uttar Pradesh.
* The project's total investment is over Rs 3,700 crore.
* The project is being developed under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP).
* **Purpose and Goals:**
* To boost India's high-end manufacturing and semiconductor ecosystem.
* To catalyze growth in ancillary sectors.
* To strengthen domestic manufacturing capabilities.
* To reduce import dependence.
* To build resilient global supply chains.
* To support key sectors such as mobile phones, tablets, laptops, automotive, consumer electronics, and other devices.
* To foster innovation, skill development, and technology transfer.
* To create thousands of direct and indirect employment opportunities.
* **Strategic Importance:**
* The project is a significant milestone in India's journey towards technological self-reliance.
* It aligns with the Prime Minister's vision of positioning India as a trusted global destination for high-end electronics and semiconductor manufacturing.
* It underscores India's growing stature in the global semiconductor landscape.
* It represents a major step forward in building a robust and self-reliant electronics manufacturing ecosystem.
**Impact Analysis**
**Semiconductor Industry in India**
*Impact:* Major boost to India's semiconductor ecosystem.
*Action Required:* Capitalize on the opportunities for growth, innovation, skill development, and technology transfer presented by this project.
**Engineers, Technicians, and Professionals**
*Impact:* Creation of thousands of direct and indirect employment opportunities.
*Action Required:* Be aware of upcoming employment possibilities in this evolving industry.
**Ancillary Industries**
*Impact:* Catalyst for growth.
*Action Required:* Prepare for increased demand and potential collaboration opportunities due to the project.
**India Chip Pvt. Ltd.**
*Impact:* Responsible for establishing and operating the OSAT facility.
*Action Required:* Successfully set up the OSAT facility within YEIDA under the Modified Scheme for ATMP.
Key Entities Referenced
HCL-Foxconn Joint Venture project: A joint venture semiconductor facility, crucial for India's semiconductor manufacturing ambitions.
Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP): The scheme under which the HCL-Foxconn facility is being established, aimed at boosting the semiconductor ecosystem.
India Chip Pvt. Ltd.: The Indian entity involved in setting up the OSAT facility under the ATMP scheme.
Yamuna Expressway Industrial Development Authority (YEIDA), Uttar Pradesh: Location of the HCL-Foxconn semiconductor facility.
Prime Minister's Office
PM to participate in groundbreaking ceremony of
HCL–Foxconn Joint Venture project on 21
February
Project to boost high end Manufacturing and Semiconductor
ecosystem in India and also catalyse growth in ancillary
sectors
Project underscores India’s growing stature in the global
semiconductor landscape
Posted On: 20 FEB 2026 6:50PM by PIB Delhi
Prime Minister Shri Narendra Modi will participate in the groundbreaking ceremony of the HCL-Foxconn
Joint Venture project - India Chip Pvt. Ltd. - in the Yamuna Expressway Industrial Development Authority
(YEIDA), Uttar Pradesh, on 21st February, 2026, at around 5 PM via video conferencing. Prime Minister
will also address the gathering on the occasion.
The establishment of the HCL-Foxconn semiconductor facility marks a significant milestone in India’s
journey towards technological self-reliance and reflects the Prime Minister’s vision of positioning India as
a trusted global destination for high-end electronics and semiconductor manufacturing.
This Outsourced Semiconductor Assembly and Test (OSAT) facility at YEIDA will be set up by India
Chip Pvt. Ltd. under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging
(ATMP), with a total investment of over Rs 3,700 crore. The project is aligned with the Government's
efforts to strengthen domestic manufacturing capabilities, reduce import dependence, and build resilient
global supply chains. It is expected to play a crucial role in supporting key sectors such as mobiles phones,
tablet, laptop, automotive, consumer electronics and other devices.
Through this initiative, India’s semiconductor ecosystem will receive a major boost, fostering innovation,
skill development, and technology transfer. The facility is also expected to create thousands of direct and
indirect employment opportunities to engineers, technicians, and professionals, while catalysing growth in
ancillary industries.
The HCL–Foxconn joint venture underscores India’s growing stature in the global semiconductor
landscape and represents a major step forward in building a robust and self-reliant electronics
manufacturing ecosystem.
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